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The increase in processing power within electrical devices has caused increased heat dissipation requirements. Typically, an electrical device will include a heat sink mounted to the processor for dissipating heat away from the processor. For example, a heat sink may be attached to a processor of a computer to dissipate heat generated by the processor. Such heat sinks may be in the form of a fan that dissipates heat from the computer or in the form of a heat pipe that is attached to the processor.
Heat sinks and heat pipes work together to dissipate heat from the processor. The heat pipe in the heat sink is the primary component that transfers heat from the processor to the atmosphere.
Typically, heat dissipation devices, including heat sinks and heat pipes, are provided in an open environment such as, for example, a computer chassis or a mobile electronic device. A heat sink or heat pipe is typically designed to dissipate heat to a surrounding atmosphere. As such, the ac619d1d87
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